Inzwa yoxinzelelo lwamafutha kwiCadillac Buick Chevrolet 13500745

Le nkqubo yoyilo kunye nokuveliswa kwenzwa yoxinzelelo ngokwenene kukusetyenziswa kweteknoloji ye-MEMS (isifinyezo se-microelectromechanicalsystems, oko kukuthi, inkqubo ye-micro-electromechanical).

I-MEMS yi-teknoloji ye-21 yekhulu leminyaka esekelwe kwi-micro / nanotechnology, eyenza ukuba iqulunqe, iqhube, ivelise kwaye ilawule izinto ezincinci / nano.Iyakwazi ukudibanisa amacandelo omatshini, iinkqubo ze-optical, iinqununu zokuqhuba, iinkqubo zokulawula i-elektroniki kunye neenkqubo zokucwangcisa idijithali kwi-micro-system njengeyunithi yonke.Le MEMS ayikwazi ukuqokelela kuphela, iqhube kwaye ithumele ulwazi okanye imiyalelo, kodwa iphinde ithathe amanyathelo ngokuzimeleyo okanye ngokwemiyalelo yangaphandle ngokolwazi olufunyenweyo.Isebenzisa inkqubo yokuvelisa ukudibanisa iteknoloji ye-microelectronics kunye neteknoloji ye-micromachining (kubandakanya i-silicon micromachining, i-silicon surface micromachining, i-LIGA kunye ne-wafer bonding, njl.I-MEMS igxininisa ukusetyenziswa kobuchwephesha obuphezulu ukuqonda ii-micro-systems kwaye igxininisa isakhono seenkqubo ezidibeneyo.

Inzwa yoxinzelelo ngummeli oqhelekileyo wetekhnoloji ye-MEMS, kwaye enye itekhnoloji ye-MEMS esetyenziswa ngokuqhelekileyo yi-MEMS gyroscope.Okwangoku, ababoneleli abaninzi benkqubo ye-EMS, njenge-BOSCH, i-DENSO, i-CONTI njalo njalo, bonke banezitshiphu zabo ezinikezelweyo ezinezakhiwo ezifanayo.Izinto eziluncedo: ukudibanisa okuphezulu, ubungakanani benzwa encinci, ubungakanani obuncinci besixhobo sokudibanisa kunye nobukhulu obuncinci, kulula ukucwangcisa nokufaka.I-chip yoxinzelelo ngaphakathi kwe-sensor ifakwe ngokupheleleyo kwi-silica gel, enemisebenzi yokuxhatshazwa kwe-corrosion kunye nokuxhatshazwa kwe-vibration, kwaye iphucula kakhulu ubomi benkonzo yenzwa.Ukuveliswa kobunzima obukhulu kuneendleko eziphantsi, isivuno esiphezulu kunye nokusebenza okugqwesileyo.

Ukongeza, abanye abavelisi bezinzwa zoxinzelelo lokuthatha basebenzisa iitshiphusi zoxinzelelo ngokubanzi, kwaye emva koko badibanise iisekethe zeperipheral ezinje ngeetshiphusi zoxinzelelo, iisekethe zokhuseleko ze-EMC kunye nezikhonkwane ze-PIN zokunxibelelanisa ngeebhodi zePCR.Njengoko kubonisiwe kuMfanekiso 3, iitshiphusi zoxinzelelo zifakwe ngasemva kwebhodi yePCB, kwaye iPCB yibhodi yePCB enamacala amabini.

Olu hlobo lwenzwa yoxinzelelo lunokudibanisa okuphantsi kunye neendleko eziphezulu zezinto.Akukho phakheji itywinwe ngokupheleleyo kwi-PCB, kwaye iinxalenye zihlanganiswe kwi-PCB ngenkqubo yemveli yokuthengisela, nto leyo ekhokelela kumngcipheko wokuthengiswa kwenyani.Kwimekobume yokungcangcazela okuphezulu, ubushushu obuphezulu kunye nokufuma okuphezulu, iPCB kufuneka ikhuselwe, enobungozi obuphezulu.