Isebenza kwiPasit fuel isivamvo soxinzelelo lukaloliwe oluqhelekileyo 06E906051K

1. Indlela yokwenza inzwa yoxinzelelo, equka:

Ukubonelela nge-substrate ye-semiconductor, apho i-first interlayer dielectric layer, i-first interlayer dielectric layer kunye ne-second interlayer ye-dielectric layer yenziwa kwi-substrate ye-semiconductor.

Ipleyiti ye-electrode esezantsi kwi-interlayer yokuqala ye-dielectric layer, i-electrode yokuqala ehlangeneyo ebekwe kumaleko afanayo nepleyiti ye-electrode esezantsi kwaye yahlulahlulwe.

Ukuqhagamshela iileya;

Ukwenza umaleko wombingelelo ngaphezu kweplate ye-polar ephantsi;

Ukwenza ipleyiti ye-electrode ephezulu kwinqanaba lokuqala le-dielectric interlayer, umaleko wokuqala wokudibanisa kunye nomgangatho wombingelelo;

Emva kokwenza umaleko wombingelelo nangaphambi kokwenza ipleyiti ephezulu, kwinqanaba lokuqala lokudibanisa

Ukwenza i-groove yokudibanisa, kunye nokuzalisa i-groove yokudibanisa kunye nepleyiti ephezulu ukudibanisa ngombane kunye nomgca wokuqala wokudibanisa; Okanye,

Emva kokwenza ipleyiti ye-electrode ephezulu, ii-grooves ezidibanisayo zenziwe kwipleyiti ye-electrode ephezulu kunye nomgangatho wokuqala wokudibanisa, othi

Ukwenza i-conductive layer edibanisa ipleyiti ye-electrode ephezulu kunye nomgca wokuqala wokudibanisa kwi-groove yokudibanisa;

Emva kokudibanisa ngombane ipleyiti ephezulu kunye nomgca wokuqala wokudibanisa, ukususa umgca wedini ukwenza umgodi.

2. Indlela yokwenza inzwa yoxinzelelo ngokwebango le-1, apho kwinqanaba lokuqala

Indlela yokwenza umaleko wedini kwi-interlayer dielectric layer iquka la manyathelo alandelayo:

Ukubeka umaleko wezinto zombingelelo kwinqanaba lokuqala le-dielectric interlayer;

Ukwenza ipateni yomaleko wedini ukwenza umaleko wedini.

3. Indlela yokwenza inzwa yoxinzelelo ngokwebango 2, apho i-photolithography kunye ne-engraving isetyenziswa.

Umaleko wezinto zombingelelo ufanekiselwa yinkqubo yokubhala.

4. Indlela yokwenza inzwa yoxinzelelo ngokwebango le-3, apho umgca wombingelelo

Izinto eziphathekayo yi-amorphous carbon okanye i-germanium.

5. Indlela yokwenza inzwa yoxinzelelo ngokwebango le-4, apho umgca wombingelelo

Izinto eziphathekayo yikhabhoni ye-amorphous;

Iigesi ze-Etching ezisetyenziselwa inkqubo yokufaka i-maleko yezinto zedini ziquka i-O2, i-CO, i-N2 kunye ne-Ar;

Iiparamitha kwinkqubo yokufaka i-maleko yezinto zedini zezi: uluhlu lokuhamba kwe-O2 yi-18 SCCM ~ 22 SCCM, kunye nesantya sokuhamba kwe-CO yi-10%.

Izinga lokuhamba livela kwi-90 SCCM ukuya kwi-110 SCCM, izinga lokuhamba kwe-N2 ukusuka kwi-90 SCCM ukuya kwi-110 SCCM, kunye nesantya se-Ar.

Uluhlu luyi-90 SCCM ~ 110 SCCM, uluhlu loxinzelelo luyi-90 mtor ~ 110 mtor, kwaye amandla okukhetha

540w～660w.